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> UMTS/3G 27 2 04
Portelligent has released data generated in its product teardown
program which indicate that the first generation of UMTS handsets released
in Europe exhibit extremely high system complexity and high estimated
manufacturing costs.
In addition to the costs paid at auction by wireless service providers to
license spectrum for UMTS systems, and the considerable investments required
to install 3G network infrastructure, it will be imperative for handset
makers to move to higher levels of system integration over time, and to
lower manufacturing costs, in order to create an environment that makes 3G
services attractive and profitable.
Product teardown analyses of three "first-wave" UMTS handsets introduced
in Europe in mid-2003 -- the NEC e-606, Motorola A830, and Nokia 6650 --
reveal extremely high values on system-level metrics such as IC count,
silicon die area, and total electronic component count, which are good
predictors of overall manufacturing cost.
Data released publicly by Portelligent at the 3GSM World exhibition in
Cannes, France, indicate that on these parameters, averages for the first
generation of UMTS handsets dramatically exceed those for a representative
2.5G handset capable of data communications using the EDGE protocol.
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Handsets Analyzed via Product Teardown |
| System-Level Metrics |
|
| |
NEC e-606 |
Motorola A830 |
Nokia 6650 |
2.5G Handset |
| |
(UMTS) |
(UMTS) |
(UMTS) |
w/EDGE (2003) |
| |
|
|
|
|
| IC Count |
108 |
68 |
29 |
13 |
| Silicon Die Area |
17.33 cm2 |
7.70 cm2 |
4.54 cm2 |
1.93 cm2 |
| Total Component Count |
1421 |
935 |
629 |
381 |
| Connection Density |
49.5/cm2 |
28/cm2 |
25.5/cm2 |
26.5/cm2 |
| Table 1: Comparison of three UMTS handsets with2.5G
phones along metrics of system complexity.
Source: Portelligent Inc. |
Early UMTS handsets in Europe also exceed in system complexity cellular
phones that implement 3G wireless communications protocols in other regions.
According to Portelligent analyses, W-CDMA capable "FOMA" (Freedom of Mobile
Multimedia Access) handsets introduced by NTT DoCoMo in the Japanese market
in 2001-2002 had average IC counts of 32, and average component counts of
727 (versus 68 and 995 respectively for the three UMTS handsets). By
contrast with UMTS, which specifies support for both W-CDMA and standard 2G
GSM communications in a dual-mode approach, early FOMA handsets supported
only W-CDMA-based communications.
A comparison of first-generation UMTS handsets with CDMA2000-protocol
handsets introduced during the same period reveals even more dramatic
differences in system complexity. If the average values for the NEC e-606,
Motorola A830, and Nokia 6650 are compared with mid-range and high-end
CDMA2000 handsets subjected to product teardown analysis by Portelligent,
the UMTS handsets exceed the CDMA2000 average by 98 percent on IC count, 109
percent in component count, and fully 154 percent in aggregate silicon die
size. Portelligent's system-level manufacturing cost estimates indicate that
cost-of-goods sold for the first-generation UMTS handsets is twice that for
representative mid-range and high-end CDMA2000 handsets.
Achieving higher levels of integration and simpler system designs in
succeeding generations of UMTS handsets, in order to substantially reduce
complexity and manufacturing costs, will be critical in making the 3G UMTS
environment profitable, for both handset makers and wireless service
providers. Of the three first-generation UMTS handsets analyzed by
Portelligent, one -- the Nokia 6650 -- was found to be considerably more
evolved on these dimensions than the other two, although in part this is
explained by its more limited imaging capabilities.
Portelligent is currently examining the "second wave" of UMTS phones as
these products are brought to market, and will perform full product teardown
analyses of several to determine how much progress has been made toward more
highly integrated, simpler, and less costly handsets.
Portelligent Inc., located in Austin, Texas, USA, offers reports and
analyses that are generated through a rigorous "product-teardown"
methodology to the electronics, wireless, semiconductor, and financial
sectors. Portelligent is a spin-out of the MCC research consortium, where
underlying analytical methods and cost models were developed.
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